JPS6142844U - フラツトパツケ−ジ - Google Patents
フラツトパツケ−ジInfo
- Publication number
- JPS6142844U JPS6142844U JP1984128100U JP12810084U JPS6142844U JP S6142844 U JPS6142844 U JP S6142844U JP 1984128100 U JP1984128100 U JP 1984128100U JP 12810084 U JP12810084 U JP 12810084U JP S6142844 U JPS6142844 U JP S6142844U
- Authority
- JP
- Japan
- Prior art keywords
- flat package
- bottom plate
- leads
- frame via
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011521 glass Substances 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims 1
- 239000013078 crystal Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984128100U JPS6142844U (ja) | 1984-08-23 | 1984-08-23 | フラツトパツケ−ジ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984128100U JPS6142844U (ja) | 1984-08-23 | 1984-08-23 | フラツトパツケ−ジ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6142844U true JPS6142844U (ja) | 1986-03-19 |
| JPH039334Y2 JPH039334Y2 (en]) | 1991-03-08 |
Family
ID=30686730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984128100U Granted JPS6142844U (ja) | 1984-08-23 | 1984-08-23 | フラツトパツケ−ジ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6142844U (en]) |
-
1984
- 1984-08-23 JP JP1984128100U patent/JPS6142844U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH039334Y2 (en]) | 1991-03-08 |
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